SN74AUP1G79DSFR

低功耗单路正边沿触发式 D 型触发器

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1 Features

• Available in the Texas Instruments NanoStar™ Package

• Low Static-Power Consumption: ICC = 0.9 µA Maximum

• Low Dynamic-Power Consumption: Cpd = 3 pF Typical at 3.3 V

• Low Input Capacitance: Ci = 1.5 pF Typical

• Low Noise: Overshoot and Undershoot < 10% of VCC

• Ioff Supports Partial Power-Down-Mode Operation

• Input Hysteresis Allows Slow Input Transition and Better Switching Noise Immunity at the Input (Vhys = 250 mV Typical at 3.3 V)

• Wide Operating VCC Range of 0.8 V to 3.6 V

• Optimized for 3.3-V Operation

• 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation

• tpd = 4 ns Maximum at 3.3 V

• Suitable for Point-to-Point Applications

• Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II

• ESD Performance Tested Per JESD 22

– 2000-V Human-Body Model (A114-B, Class II)

– 1000-V Charged-Device Model (C101)

2 Applications

• Barcode Scanner

• Cable Solutions

• E-Book

• Embedded PC

• Field Transmitter: Temperature or Pressure Sensor

• Fingerprint Biometrics

• HVAC: Heating, Ventilating, and Air Conditioning

• Network-Attached Storage (NAS)

• Server Motherboard and PSU

• Software Defined Radio (SDR)

• TV: High-Definition (HDTV), LCD, and Digital

• Video Communications System

• Wireless Data Access Card, Headset, Keyboard, Mouse, and LAN Card

3 Description

The AUP family is TI s premier solution to the industry s low-power needs in battery-powered portable applications. This family assures a very-low static and dynamic power consumption across the entire VCC range of 0.8 V to 3.6 V, thus resulting in an increased battery life. The AUP devices also maintain excellent signal integrity.

The SN74AUP1G79 is a single positive-edgetriggered D-type flip-flop. When data at the data (D) input meets the setup-time requirement, the data is transferred to the Q output on the positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not directly related to the rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without affecting the levels at the outputs.

NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

The SN74AUP1G79 device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs when the device is powered down. This inhibits current backflow into the device which prevents damage to the device.