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首页设计与方案WL1835MODCOM8A_TI(德州仪器)中文资料_英文资料_价格_PDF手册
WL1835MODCOM8A_TI(德州仪器)中文资料_英文资料_价格_PDF手册
2026-01-09 15:00:05
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WL1835MODCOM8A

DEV BOARD WL1835 MODULE

 

 

 

Warning

 

The WL1835MODCOM8B board is tested to comply with ETSI/R&TTE over temperatures from –20°C to 85°C.

 

This board should not be modified to operate in other frequency bands other than what they are designed for.

 

FCC Licensing Requirements for the Wi-Fi and Bluetooth Radio Module of the EVM:

For evaluation only; not FCC approved for resale. This kit is designed to allow:

1. Product developers to evaluate electronic components, circuitry, or software associated with the kit to determine whether to incorporate such items in a finished product

2. Software developers to write software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is designed to operate under part 15, part 18, or part 95 of this chapter, the operator of the kit must operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter.

 

Per TI’s Regulatory Compliance Information located in the WL1835ModCOMB8B User’s Guide’s “Evaluation Board/Kit/Module (EVM) Additional Terms,” this EVM cannot be used for production purposes and is explicitly restricted from end-product introduction.

 

Use of this EVM requires the developer to provide a minimum distance of at least 20 cm from the antenna to all persons in order to minimize risk of potential radiation hazards.

 

 

1 Introduction

 

The WL1835MODCOM8B device is a Wi-Fi® MIMO, Bluetooth, and Bluetooth Low Energy (BLE) module board with the TI WL18MODGB module. WL18MODGB is built-in TI WL1835 IEEE 802.11 b/g/n and Bluetooth 4.0 solutions to provide the best Wi-Fi and Bluetooth coexistence interoperability and powersaving technologies from TI.

 

 WL1835MODCOM8B 顶视图.png

 

1.1 Features

 

• WLAN, Bluetooth, BLE on a module board

• 100-pin board card

• Dimension 76.0 mm(L) x 31.0 mm(W)

• WLAN 2.4 GHz SISO (20- and 40-MHz channels), 2.4-GHz MIMO (20-MHz channels)

• Support for BLE dual mode

• Seamless integration with TI Sitara and other application processors

• Design for TI AM335X general-purpose EVM

• WLAN and Bluetooth, BLE cores are software and hardware compatible with prior WL127x, WL128x and CC256x offerings, for smooth migration to device.

• Shared HCI transport for Bluetooth and BLE over UART and SDIO for WLAN.

• Wi-Fi / Bluetooth single antenna co-existence

• Built-in chip antenna

• Optional U.FL RF connector for external 2.4-GHz band antenna

• Direct connection to battery using external switching mode power supply supporting 4.8-V to 2.9-V operation

• VIO in the 1.8-V domain

 

 

1.2 Applications

 

• Internet of Things Multimedia

• Home Electronics

• Home Appliances and White Goods

• Industrial and Home Automation

• Smart Gateway and Metering

• Video Conferencing

• Video Camera and Security

 

1.3 TI Module Key Benefits

• Reduces Design Overhead: Single WiLink8™ Module Scales Across Wi-Fi and Bluetooth.

• WLAN High Throughput: 80 Mbps (TCP), 100 Mbps (UDP)

• Bluetooth 4.0 + BLE (Smart Ready)

• Wi-Fi-Bluetooth Single Antenna Coexistence

• Low Power (30–50% Less than Previous Generation)

• Available as Easy-to-Use FCC, ETSI, and Telec Certified Module

• Lower Manufacturing Costs, Saving Board Space and Minimizing RF Expertise

• AM335x Linux® and Android™ Reference Platform Accelerates Customer Development and Time to Market

 

2 Board Pin Assignment

 

 ScreenShot_2026-01-09_145544_572.png


WL1835MODCOM8A DEV BOARD WL1835 MODULE