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首页设计与方案SN74AUP1G80DSFR_TI(德州仪器)中文资料_英文资料_价格_PDF手册
SN74AUP1G80DSFR_TI(德州仪器)中文资料_英文资料_价格_PDF手册
2024-09-11 09:52:54
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SN74AUP1G80DSFR   低功耗单路上升沿 D 级触发器

 

1 Features

 

• Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II

• ESD Performance Tested Per JESD 22

– 2000-V Human-Body Model (A114-B, Class II)

– 1000-V Charged-Device Model (C101)

• Available in the Texas Instruments NanoStar™ Package

• Low Static-Power Consumption (ICC = 0.9 µA Maximum)

• Low Dynamic-Power Consumption (Cpd = 4.3 pF Typical at 3.3 V)

• Low Input Capacitance (Ci = 1.5 pF Typical)

• Low Noise

– Overshoot and Undershoot <10% of VCC

• Ioff Supports Partial-Power-Down Mode Operation

• Schmitt-Trigger Action Allows Slow Input Transition and Better Switching Noise Immunity at the Input (Vhys = 250 mV Typical at 3.3 V)

• Wide Operating VCC Range of 0.8 V to 3.6 V

• Optimized for 3.3-V Operation

• 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation

• tpd = 4.4 ns Maximum at 3.3 V

• Suitable for Point-to-Point Applications

 

 

2 Applications

 

• Home Automation

• Factory Automation

• Test and Measurement

• Enterprise Switching

• Telecom Infrastructure

• Personal Electronics

• White Goods

 

 

3 Description

 

The AUP family is TI's premier solution to the industry's low-power needs in battery-powered portable applications. This family assures a low staticand dynamic-power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in increased battery life (see AUP – The Lowest-Power Family). This product also maintains excellent signal integrity (see Excellent Signal Integrity).

 

This is a single positive-edge-triggered D-type flipflop. When data at the data (D) input meets the setup time requirement, the data is transferred to the Q output on the positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not directly related to the rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without affecting the levels at the outputs.

 

NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

 

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs when the device is powered down. This inhibits current backflow into the device which prevents damage to the device.


SN74AUP1G80DSFR 低功耗单路上升沿 D 级触发器